Platform Engineer

PayPay Card Corporation Chiyoda City, Tokyo
  • 💴 No salary range given
  • 🏡 Fully remote
  • 🧪 5+ years experience required
  • 💬 No Japanese required
  • 🌏 Apply from abroad
  • 🧳 Relocate to Japan
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About PayPay Card Corporation

PayPay Card Corporation Chiyoda City, Tokyo

PayPay Card was established in 2021 to provide users with more accessible and convenient FinTech services that were previously not possible with credit cards and credit services by integrating with the PayPay payment platform.

Key benefits

  • Part of PayPay Group
  • Internationalizing engineering division
  • Building an English product team from scratch

About the position

We are looking for a Cloud infrastructure and platform engineer for PayPay Card’s cloud system. This role will responsible for the engineering of Cloud Infrastructure Platforms to provide robust, reliable and cost-efficient Platform so that we can deliver the best experience for our growing customers base.

PayPay Card aims at revolutionizing the credit card industry, making payment easier than ever, from two different angles:

  • Bring the credit card experience to the next level: we have many functionalities in the pipe to improve our product, not to mention the integration into the PayPay ecosystem as PayPay Card is part of the PayPay Group.
  • (Re-)architect our systems landscape: we want to reassess and fix the behind-the-scenes to power a top-notch user experience. It is bundled with difficult design challenges to solve: we simply want to get it right.

As a fast-paced company leading the payments industry, we need our engineers to be versatile and enthusiastic to take on new challenges in order to stay at the forefront. Indeed, we strive for continuous improvement within our systems as well as outside our systems. Additionally, we value communication, to smoothly cooperate with other teams, and inclusivity, to efficiently navigate in a multicultural environment.

Responsibilities

  • Architect and build a robust, scalable and stable infrastructure
  • Architect and build Infrastructure that is easily maintainable during patching and upgrades
  • Architect and build Infrastructure with AWS regional level failure tolerance
  • Work together with our Security Engineers to provision a secure Infrastructure
  • Automations for AWS Deployments to ensure fast delivery of Cloud Services to our developers
  • Provide through Automations means for developers to easily deploy resources on AWS.

Requirements

  • More than 5 years of technical experience in Cloud based Infrastructure Platform
  • Ability to demonstrate high degree of ownership in a Production environment
  • Good understanding of Cloud security best practices and payment industry compliance standards
  • Experience in Cloud infrastructure and platform systems availability, performance and cost management
  • Extensive technical handson experience of Computing, Storage and Analytical Services on Cloud(AWS)
  • Experience with IAC tools in AWS such as Terraform, CloudFormation, CDK
  • Experience with Linux Internals and System Administration
  • Experience with Cloud Services Monitoring, Detection and Response
  • Experience in Cloud Services Performance Tuning, cost controls and management
  • Experience in Cloud Infrastructure Service patching and upgrades
  • Have excellent oral, written, verbal and interpersonal communication skills.

Nice to haves

While not specifically required, tell us if you have any of the following.

  • Bachelor’s degree and above in a technology related field
  • Experience with other cloud service providers (e.g GCP, Azure)
  • Experience with Kubernetes
  • Experience with Event-Driven Architecture (Kafka preferred)
  • Experience using and contributing to Open Source tools
  • Experience in managing IT compliance and security risk
  • Published papers / blogs / articles - Relevant and verifiable certifications
  • Proficiency in Japanese

Hiring Process

  1. 1

    Application Review

    Please submit an English CV when applying.

  2. 2

    3-4 Interviews

    Includes both technical and behavioural interviews.

  3. 3

    Offer Meeting

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